PACK EXPO International 2026

DASE-SING Packaging Technology will participate in PACK EXPO International 2026, taking place from October 18–21, 2026 at McCormick Place in Chicago, USA.

At this year’s show, DASE-SING will showcase its latest solutions in high-speed shrink sleeve labeling, automated packaging, and sustainable packaging technologies, with a focus on 20μm ultra-thin film applications, downgauging solutions, high-speed labeling, and smart production line integration.

Through these innovations, DASE-SING aims to help manufacturers improve production efficiency while reducing material usage and supporting sustainability and ESG goals.

PACK EXPO International 2026
McCormick Place, Chicago, USA
October 18–21, 2026
Lakeside Upper | Booth LU-8849